Micross Components Awarded $134.3 Million DOD Contract

Melville, N.Y.—Micross Components Inc., a provider of high-reliability microelectronic products and services for aerospace, defense, space, medical, energy and other high-reliability applications, is pleased to announce that it has received an award under the IBAS Cornerstone RESHAPE program with a ceiling value of up to $134.3 million, with $45.6 million obligated at the time of the award. The award was made through the Department of Defense (DOD) to develop trusted, pure-play and open-access Advanced Packaging capabilities and capacity for low-volume/high-mix production of secure 2.5/3D Advanced System Integration and Packaging (ASIP) solutions.

This effort focuses on Back End of Line (BEOL) processes for 300 mm wafer diameter capabilities aimed at low-volume, high-mix, secure manufacturing capabilities that all Defense Industrial Base companies can design into their next-generation applications, ensuring access and availability to a United States microelectronics ecosystem that enables secure and comprehensive components and system integrations. The IBAS Cornerstone Re-shore Ecosystem for Secure Heterogeneous Advanced Packaged Electronics (RESHAPE) award includes options for additional advanced packaging manufacturing capabilities, which would further augment Micross’ production capabilities and accelerate throughput, the company says.

“The Defense Industrial Base will benefit from the RESHAPE onshoring effort to further advanced packaging manufacturing capabilities with Micross Components,” says Matt Walsh, OSD IBAS advanced packaging chief engineer. “The OSD IBAS organization understands the critical need for an advanced packaging ecosystem in the U.S., and this contract award to Micross is part of that effort.”